2007-07-24 1 bcr523... npn silicon digital transistors ? switching circuit, inverter circuit, driver circuit ? built in bias resistor ( r 1 = 1 k ? , r 2 = 10 k ? ) ? bcr523u: two (galvanic) internal isolated transistors with good matching in one package ? pb-free (rohs compliant) package 1) ? qualified according aec q101 bcr523 bcr523u eha07184 3 2 1 c e b r 1 r 2 eha07174 6 54 3 2 1 c1 b2 e2 c2 b1 e1 1 r r 2 r 1 r 2 tr1 tr2 type marking pin configuration package bcr523 bcr523u xgs xgs 1=b 1=e1 2=e 2=b1 3=c 3=c2 - 4=e2 - 5=b2 - 6=c1 sot23 sc74 maximum ratings parameter symbol value unit collector-emitter voltage v ceo 50 v collector-base voltage v cbo 50 input forward voltage v i(fwd) 12 input reverse voltage v i(rev) 5 collector current i c 500 ma total power dissipation- t s 79 c, bcr523 t s 115 c , bcr523u p tot 330 330 mw junction temperature t j 150 c storage temperature t stg -65 ... 150
2007-07-24 2 bcr523... thermal resistance parameter symbol value unit junction - soldering point 2) bcr523 bcr523u r thjs 215 105 k/w electrical characteristics at t a = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dc characteristics collector-emitter breakdown voltage i c = 100 a, i b = 0 v (br)ceo 50 - - v collector-base breakdown voltage i c = 10 a, i e = 0 v (br)cbo 50 - - collector-base cutoff current v cb = 50 v, i e = 0 i cbo - - 100 na emitter-base cutoff current v eb = 5 v, i c = 0 i ebo - - 0.72 ma dc current gain- i c = 50 ma, v ce = 5 v h fe 70 - - - collector-emitter saturation voltage 3) i c = 50 ma, i b = 2.5 ma v cesat - - 0.3 v input off voltage i c = 100 a, v ce = 5 v v i(off) 0.3 - 1 input on voltage i c = 10 ma, v ce = 0.3 v v i(on) 0.4 - 1.4 input resistor r 1 0.7 1 1.3 k ? resistor ratio r 1 / r 2 0.09 0.1 0.11 - ac characteristics transition frequency i c = 50 ma, v ce = 5 v, f = 100 mhz f t - 100 - mhz 1 pb-containing package may be available upon special request 2 for calculation of r thja please refer to application note thermal resistance 3 pulse test: t < 300s; d < 2%
2007-07-24 3 bcr523... dc current gain h fe = ? ( i c ) v ce = 5 v (common emitter configuration) 10 -4 10 -3 10 -2 10 -1 10 0 a i c 0 10 1 10 2 10 3 10 h fe -40 c -25 c 25 c 85 c 125 c collector-emitter saturation voltage v cesat = ? ( i c ), h fe = 20 10 -3 10 -2 10 -1 10 0 a i c 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 v 0.5 v cesat -40 c -25 c 25 c 85 c 125 c input on voltage v i (on) = ? ( i c ) v ce = 0.3v (common emitter configuration) 10 -4 10 -3 10 -2 10 -1 10 0 a i c -1 10 0 10 1 10 v v i(on) -40 c -25 c 25 c 85 c 125 c input off voltage v i(off) = ? ( i c ) v ce = 5v (common emitter configuration) 10 -5 10 -4 10 -3 10 -2 a i c -1 10 0 10 1 10 v vi(off) -40 c -25 c 25 c 85 c 125 c
2007-07-24 4 bcr523... total power dissipation p tot = ? ( t s ) bcr523 0 20 40 60 80 100 120 c 150 t s 0 50 100 150 200 250 300 mw 400 p tot total power dissipation p tot = ? ( t s ) bcr523u 0 20 40 60 80 100 120 c 150 t s 0 50 100 150 200 250 300 mw 400 p tot permissible pulse load p totmax / p totdc = ? ( t p ) bcr523 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 4 10 - p totmax / p totdc d = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible pulse load r thjs = ? ( t p ) bcr523 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs 0.5 0.2 0.1 0.05 0.02 0.01 0.005 d = 0
2007-07-24 5 bcr523... permissible pulse load p totmax / p totdc = ? ( t p ) bcr523u 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p 0 10 1 10 2 10 3 10 p totmax / p totdc d=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 permissible puls load r thjs = ? ( t p ) bcr523u 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s t p -1 10 0 10 1 10 2 10 3 10 k/w r thjs d=0.5 0.2 0.1 0.05 0.02 0.01 0.005 0
2007-07-24 6 bcr523... package sc74 package outline foot print standard packing 0.5 0.95 1.9 2.9 54 6 3 2 1 1.1 max. (0.35) (2.25) 0.2 2.9 b 0.2 +0.1 -0.05 0.35 pin 1 marking m b 6x 0.95 1.9 0.15 -0.06 +0.1 1.6 10? max. a 0.1 2.5 0.25 10? max. 0.1 0.1 a 0.2 m 0.1 max. 2.7 4 3.15 pin 1 marking 8 0.2 1.15 reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel for symmetric types no defined pin 1 orientation in reel. manufacturer 2005, june date code (year/month) bcw66h type code pin 1 marking laser marking marking layout (example) small variations in positioning of date code, type code and manufacture are possible.
2007-07-24 7 bcr523... package sot23 package outline foot print marking layout (example) standard packing reel ?180 mm = 3.000 pieces/reel reel ?330 mm = 10.000 pieces/reel eh s bcw66 type code pin 1 0.8 0.9 0.9 1.3 0.8 1.2 0.25 m bc 1.9 -0.05 +0.1 0.4 0.1 2.9 0.95 c b 0...8? 0.2 a 0.1 max. 10? max. 0.08...0.15 1.3 0.1 10? max. m 2.4 0.15 0.1 1 a 0.15 min. 1) 1) lead width can be 0.6 max. in dambar area 12 3 3.15 4 2.65 2.13 0.9 8 0.2 1.15 pin 1 manufacturer 2005, june date code (ym)
2007-07-24 8 bcr523... edition 2006-02-01 published by infineon technologies ag 81726 mnchen, germany ? infineon technologies ag 2007. all rights reserved. attention please! the information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (?beschaffenheitsgarantie?). with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices please contact your nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements components may contain dangerous substances. for information on the types in question please contact your nearest infineon technologies office. infineon technologies components may only be used in life-support devices or systems with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
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